Sn(OOCC7H15)2  SnC2O4 (C4H9)2Sn  (OOCC11H23)2  (C4H9)2Sn (OOCCH3)2  (C4H9)2Sn (OOCCH)2  (C4H9)2SnO  (C4H9)Sn(OH)2Cl  (C4H9)SnOOH  Bi (CH3SO3)3 KOOCC7H15  Cu (OOCR)2  CH4SO3H  CH14H18O4  Sodium Methanesul phonate Solution  Potassium Methanesulphonate  Solution Stannous Pyrophosphate  Copper(11) Pyrophosphate Stannous chloride  CuSo4 NiSo4 Nisulfamate
 
 
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Metal Plating Chemicals >>> Metal salts

 

TMG Chemicals is the world's leading producer and distributor of metal finish products, offering high quality metal finishing chemicals for most plating processes. Whether metal salts for the formulation of electroplating baths or organic intermediates for the preparation of special additives, it is always worth having a look at our product portfolio. One of our specialized skills is to adapt our products to the specific requirements of our customers, for example in terms of tailored concentration ratios. We are continuously searching for new ideas to help our customers solve their problems. Wherever in the world a process provider develops a new metal finishing bath, TMG Chemicals is one of the most preferred contacts regarding the supply management of the chemicals required, even if they are all new. Moreover, we are in a position to offer our customers the metal salts for tin, nickel, copper plating.

 

Trade name formula chemical name application
Stannous Sulfate SnSO4 Stannous Sulfate Tin plating
Stannous Pyrophosphate Sn2P2O7 Stannous Pyrophosphate Tin plating
Stannous Oxide SnO Stannous Oxide Tin plating
Stannous Methanesulphonate Sn(CH3SO3)2 Stannous Methanesulphonate Solution Tin plating
Stannous Chloride Anhydrous SnCl2 Stannous Chloride Anhydrous Tin Plating
Stannous Chloride Dihydrate SnCl2.2H2O Stannous Chloride dihydrate Tin plating
Sodium Hexahydroxystannate Na2[Sn(OH)6] Sodium Hexahydroxystannate Tin plating
Potassium Hexahydroxystannate K2[Sn(OH)6] Potassium Hexahydroxystannate Tin plating
Methanesulfonic acid 70% CH3SO3H Methanesulfonic acid 70% Tin plating
Stannic Chloride Anhydrous SnCL4 Stannic Chloride Anhydrous Tin Plating
Silver(Ⅰ)Methanesulfonate Ag(CH3SO3 ) Silver(Ⅰ)Methanesulfonate Silver plating
pottasium pyrophosphate K4P2O7 pottasium pyrophosphate Copper plating
Copper(Ⅱ)Pyrophosphate Cu2P2O7.H2O Copper(Ⅱ)Pyrophosphate Copper plating
Copper(Ⅱ)Oxide EPG CuO Copper(Ⅱ)Oxide EPG Copper plating
Copper(Ⅱ)Methanesulonate Cu(CH3SO3 )2 Copper(Ⅱ)Methanesulonate Copper plating
Copper(Ⅱ)sulfate CuSO4 Copper(Ⅱ)sulfate Copper plating
Nickel sulfate NiSO4 Nickel sulfate Nickel plating
Nickel sulfamate Ni(NH2SO3)2 Nickel sulfamate Nickel plating
Nickel acetate Ni(CH3COO)2.4H2O Nickel acetate Nickel plating
Sodium Hypophosphite NaH2PO2.H2O Sodium Hypophosphite Nickel Plating
Chromium(Ⅲ) Nitrate Nonahydrate Cr(NO3)3.9H2O Chromium(Ⅲ) nitrate nonahydrate Metal Plating
Chromium(Ⅲ) Nitrate Solution Cr(NO3)3 Chromium(Ⅲ) Nitrate Solution Metal Plating
Bismuth(Ⅲ)Methanesulfonate Bi(CH3SO3 )3 Bismuth(Ⅲ)Methanesulfonate Bismuth plating